型号描述

型号 生产品牌/企业名称 功能参数描述 LOGO 操作
CI160808-18NJ

BournsBourns Inc.

伯恩斯(邦士)伯恩斯(邦士)

Multi-Layer Chip Inductors FIXED IND 18NH 300MA 500MOHM SMD Bournslogo
CI160808-1N5D

BournsBourns Inc.

伯恩斯(邦士)伯恩斯(邦士)

Multi-Layer Chip Inductors FIXED IND 1.5NH 300MA 100MOHM SM Bournslogo
CI160808-1N0D

BournsBourns Inc.

伯恩斯(邦士)伯恩斯(邦士)

Multi-Layer Chip Inductors FIXED IND 1NH 300MA 100 MOHM SMD Bournslogo
CI160808-1N2D

BournsBourns Inc.

伯恩斯(邦士)伯恩斯(邦士)

Multi-Layer Chip Inductors FIXED IND 1.2NH 300MA 100MOHM SM Bournslogo
CI160808-15NJ

BournsBourns Inc.

伯恩斯(邦士)伯恩斯(邦士)

Multi-Layer Chip Inductors FIXED IND 15NH 300MA 450MOHM SMD Bournslogo
CI160808-12NJ

BournsBourns Inc.

伯恩斯(邦士)伯恩斯(邦士)

Multi-Layer Chip Inductors FIXED IND 18NH 300MA 500MOHM SMD Bournslogo
CI160808-1N8D

BournsBourns Inc.

伯恩斯(邦士)伯恩斯(邦士)

Multi-Layer Chip Inductors FIXED IND 1.8NH 300MA 120MOHM SM Bournslogo
CI160808-10NJ

BOURNS

BOURNSlogo
CI160808-1N8S

FENGJUIFENGJUI TECHNOLOGY CO. LTD.

FENGJUI TECHNOLOGY CO., LTD.

EMI SOLOTION PRODUCTS-RoHS FENGJUIlogo
CI160808-1N5S

FENGJUIFENGJUI TECHNOLOGY CO. LTD.

FENGJUI TECHNOLOGY CO., LTD.

EMI SOLOTION PRODUCTS-RoHS FENGJUIlogo

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